A
Advanced Silicon Etch
Airgap
B
B-staging
Ball bonding
Barrier metal
Borophosphosilicate glass
Boule (crystal)
Bridgeman technique
Burn-in ovens
C
Capacitance voltage profiling
Chemical beam epitaxy
Chemical vapor deposition
Chemical-mechanical planarization
Alfred Y. Cho
Cleanroom
Cobilt
Czochralski process
D
DUT board
Deal-Grove model
Deep reactive-ion etching
Device under test
Die attachment
Die preparation
Doping (semiconductor)
Dry etching
E
Electron beam induced current
Electron beam lithography
Epitaxy
Epiwafer
Etching (microfabrication)
Evaporation (deposition)
Extreme ultraviolet lithography
F
FINETECH GmbH & Co. KG
Fabless semiconductor company
Float-zone silicon
Floating zone crystal growth
Focused ion beam
Foundry (electronics)
Foundry model
Furnace anneal
G
Gas immersion laser doping
Gate count
H
Hardmask
I
Immersion lithography
Integrated circuit encapsulation
Integrated circuit packaging
Integrated device manufacturer
Interference lithography
Ion Beam Mixing
Ion beam
Ion implantation
L
Laser trimming
Liquid phase epitaxy
M
MOSIS
Mask set
Mask shop
Maskless lithography
Mercury probe
Metal-induced crystallization
Metalorganic chemical vapor deposition
Metalorganic vapour phase epitaxy
Molecular-beam epitaxy
Multi wire saw
Multiple patterning
O
Ohmic contact
P
PROLITH
Phase-shift mask
Phenol formaldehyde resin
Phosphosilicate glass
Photolithography
Photomask
Photoplotter
Photoresist
Physical vapor deposition
Planar process
Plasma ashing
Plasma cleaning
Plasma etching
Pulsed laser deposition
Pure-play semiconductor foundry
R
RCA clean
Rapid thermal anneal
Reactive-ion etching
Resist
Rigid needle adapter
S
Semiconductor Equipment and Materials International
Salicide
Semiconductor device fabrication
Semiconductor industry
Shallow trench isolation
Silicate glass
Silicon on sapphire
Single crystal
Smart Cut
Spin coating
Sputter deposition
Stepper
Substrate mapping
Surface photovoltage
T
Thin-film deposition
Titanium nitride
Trimethylgallium
Trimethylindium
V
Vacuum oven
Vapour phase decomposition
W
Wafer (electronics)
Wafer dicing
Wafer fabrication
Wafer-scale integration
Wet etching
Wire bonding
X
X-ray lithography
Fonte: Wikipedia
Advanced Silicon Etch
Airgap
B
B-staging
Ball bonding
Barrier metal
Borophosphosilicate glass
Boule (crystal)
Bridgeman technique
Burn-in ovens
C
Capacitance voltage profiling
Chemical beam epitaxy
Chemical vapor deposition
Chemical-mechanical planarization
Alfred Y. Cho
Cleanroom
Cobilt
Czochralski process
D
DUT board
Deal-Grove model
Deep reactive-ion etching
Device under test
Die attachment
Die preparation
Doping (semiconductor)
Dry etching
E
Electron beam induced current
Electron beam lithography
Epitaxy
Epiwafer
Etching (microfabrication)
Evaporation (deposition)
Extreme ultraviolet lithography
F
FINETECH GmbH & Co. KG
Fabless semiconductor company
Float-zone silicon
Floating zone crystal growth
Focused ion beam
Foundry (electronics)
Foundry model
Furnace anneal
G
Gas immersion laser doping
Gate count
H
Hardmask
I
Immersion lithography
Integrated circuit encapsulation
Integrated circuit packaging
Integrated device manufacturer
Interference lithography
Ion Beam Mixing
Ion beam
Ion implantation
L
Laser trimming
Liquid phase epitaxy
M
MOSIS
Mask set
Mask shop
Maskless lithography
Mercury probe
Metal-induced crystallization
Metalorganic chemical vapor deposition
Metalorganic vapour phase epitaxy
Molecular-beam epitaxy
Multi wire saw
Multiple patterning
O
Ohmic contact
P
PROLITH
Phase-shift mask
Phenol formaldehyde resin
Phosphosilicate glass
Photolithography
Photomask
Photoplotter
Photoresist
Physical vapor deposition
Planar process
Plasma ashing
Plasma cleaning
Plasma etching
Pulsed laser deposition
Pure-play semiconductor foundry
R
RCA clean
Rapid thermal anneal
Reactive-ion etching
Resist
Rigid needle adapter
S
Semiconductor Equipment and Materials International
Salicide
Semiconductor device fabrication
Semiconductor industry
Shallow trench isolation
Silicate glass
Silicon on sapphire
Single crystal
Smart Cut
Spin coating
Sputter deposition
Stepper
Substrate mapping
Surface photovoltage
T
Thin-film deposition
Titanium nitride
Trimethylgallium
Trimethylindium
V
Vacuum oven
Vapour phase decomposition
W
Wafer (electronics)
Wafer dicing
Wafer fabrication
Wafer-scale integration
Wet etching
Wire bonding
X
X-ray lithography
Fonte: Wikipedia
